BGA Reballing Station | Universal Fixed Steel Mesh Stencil Kit for Chip Repair | Aluminum Alloy Solder Tool for Phones/Laptops/CPUs | HT - 80H Model with 5 Accessories

Frustrated with inconsistent BGA reballing results? Damaging precious chips during repair can cost hundreds in replacements. Imagine achieving excellent solder ball alignment every time—quicker repairs, happier clients, and increased workshop revenue. Our HT-80H BGA Reballing Station solves this with its universal aluminum alloy fixture fitting 9mm to 43mm chips. The electroplated finish guards against oxidation while the steel mesh stencil ensures accuracy. Includes 5 accessories and hex wrench for complete phone, laptop, and CPU repair readiness.Item Type: For BGA Reballing StationProduct Model: HT-80HMaterial: Aluminum alloyUses: For BGA manual welding for cell phone, chip, laptop CPU, cell phone digital products plant tin rework.Features: For BGA universal reballing station with all aluminum alloy electroplating, not easy to oxidize, and more abrasion-proof.Application: Suitable for all for BGA chip ball planting, regardless of rectangular or square chip.Suitable for BGA chip reballing of approx. 9 x 9mm / 0.4 x 0.4in to approx. 43 x 43mm / 1.7 x 1.7in chips.Package List：1 x For BGA Reballing Station(5pcs removable accessories)1 x Hex Wrench

• Sturdy Aluminum Alloy Build - This BGA rework station features a lightweight aluminum alloy structure. Its electroplated finish guards against oxidation and abrasion, ensuring extended service for delicate chip repair.
• Universal Chip Compatibility - Our reballing fixture handles both rectangular and square BGA chips from 9mm to 43mm. The steel mesh stencil provides excellent solder ball placement for phones and laptops.
• Accurate Manual Welding - Designed for repair professionals, this kit enables precise plant tin rework. The included hex wrench and accessories streamline BGA reballing for mobile devices.
• Time-Efficient Rework - The HT-80H station reduces setup time with its universal design. Its fixed mesh stencil ensures quick alignment for chip reballing operations.
• Oxidation-Guarding Performance - Our aluminum alloy construction prevents degradation. This BGA station delivers consistent results for critical phone and chip repair work.